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Samsung HBM3E chips reportedly fail to meet Nvidia's heat and power requirements

Retrieved on: 2024-05-26 06:25:27

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Samsung HBM3E chips reportedly fail to meet Nvidia's heat and power requirements. View article details on hiswai:

Summary

The article discusses Samsung's semiconductor issues with its HBM3 and HBM3E memory failing Nvidia's tests due to heat and power problems, impacting their AI processor market, while competitors like SK Hynix benefit. This relates to computer memory advancements by major fabless semiconductor companies in the context of the industry applications and market implications.

Article found on: www.tomshardware.com

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