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Retrieved on: 2024-07-19 11:29:11
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Summary
The article discusses a significant R&D initiative led by TIE to develop high-performance chiplets for the US Department of Defense, incorporating the concept of "Digital Twin" for advanced microsystems. This is crucial for integrated circuits and the semiconductor industry, involving key players like Intel, Micron, and Amkor Technology.
Article found on: www.eenewseurope.com
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