3D die-on-die IP for TSMC 5nm process

Retrieved on: 2021-05-24 14:48:45

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3D die-on-die IP for TSMC 5nm process. View article details on hiswai:

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Taiwanese chip designer Global Unichip Corp (GUC) has launched 3D die-to-die interconnect for TSMC's 5nm N5 and N6 process technology for AI, ...

Article found on: www.eenewseurope.com