Article Details
Retrieved on: 2024-12-11 17:11:49
Tags for this article:
Click the tags to see associated articles and topics
Summary
The article discusses Apple's development of a new AI chip, codenamed 'Baltra', leveraging TSMC's 3nm process and involving Broadcom for chiplet contributions. This relates to enhancing Apple Intelligence servers, highlighting TSMC's role in Apple's technological advancements.
Article found on: wccftech.com
This article is found inside other hiswai user's workspaces. To start your own collection, sign up for free.
Sign UpAlready have an account? Log in here