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Deals bring PCIe 6.0 and HBM3 to FPGA prototyping for Data Centre and AI chips - eeNews Europe

Retrieved on: 2021-12-09 23:06:28

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Deals bring PCIe 6.0 and HBM3 to FPGA prototyping for Data Centre and AI chips - eeNews Europe. View article details on HISWAI: https://www.eenewseurope.com/news/deals-bring-pcie-60-and-hbm3-fpga-prototyping-data-centre-and-ai-chips

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... NVMe and embedded storage, and AI/ML SoC designs that incorporate the latest high speed interconnect and memory technologies. Related articles.

Article found on: www.eenewseurope.com

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