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Goldstone, CIIF co-lead $392m funding in Chinese AIoT chip maker ESWIN - DealStreetAsia

Retrieved on: 2021-12-01 11:17:23

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Goldstone, CIIF co-lead $392m funding in Chinese AIoT chip maker ESWIN - DealStreetAsia. View article details on HISWAI: https://www.dealstreetasia.com/stories/aiot-chip-maker-eswin-series-c-272117/

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Other investors include Shang Qi Capital, the private equity (PE) arm of Chinese state-owned automaker SAIC Motor; an investment platform ...

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