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GUC announces GLink-3D die-on-die interface IP using TSMC N5 and N6 process for 3DFabric ...

Retrieved on: 2021-05-24 02:10:40

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GUC announces GLink-3D die-on-die interface IP using TSMC N5 and N6 process for 3DFabric .... View article details on hiswai:

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TSMC's 3DFabric SoIC platform technology allows much more efficient connectivity. GLink-3D achieved six times higher bandwidth/area density, six ...

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