GUC Unveils Die-on-Die Interface IP Using TSMC N5 and N6 Process

Retrieved on: 2021-05-28 03:00:53

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GUC Unveils Die-on-Die Interface IP Using TSMC N5 and N6 Process. View article details on hiswai:

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GUC has announced GLink-3D die-on-die interface IP using TSMC's N5 and N6 processes, and 3DFabric packaging technology for AI, HPC, and ...

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