Article Details
Retrieved on: 2019-09-14 03:52:30
Tags for this article:
Click the tags to see associated articles and topics
Excerpt
<div>The component is designed by the Chinese manufacturer's HiSilicon unit and is manufactured by <b>TSMC</b> using its 7nm+ EUV process. Essentially, EUV ...</div>
Article found on:
This article is found inside other hiswai user's workspaces. To start your own collection, sign up for free.
Sign UpAlready have an account? Log in here