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Samsung Electronics to Develop Its Own New Packaging Process

Retrieved on: 2017-12-27 11:45:00

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<div>Its plan is to once again win orders of Apple's application processors (AP) that were taken by Taiwan's <b>TSMC</b>. <b>TSMC</b> took entire supplies of Apple's APs from Samsung Electronics in 2016 by presenting state-of-the-art front-end wafer manufacturing capabilities and new packaging technologies.</div>

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