Tag: Back end of line

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TSMC launches WoW 3D chip packaging tech

Added to Collection on: 2018-05-02 17:33:45

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Intel
Electronic engineering
Semiconductor devices
Integrated circuits
Semiconductor device fabrication
Wafer
Through-silicon via
Three-dimensional integrated circuit
Taiwan Semiconductor
MOSFETs
Electronics industry
5 nm process
7 nm process
Back end of line

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Delivering power from the back of a chip

Added to Collection on: 2021-06-14 14:15:00

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Semiconductor device fabrication
Electronics industry
Semiconductor devices
Technology
Wafer backgrinding
Back end of line
Wafer
Integrated circuit
FinFET
Through-silicon via
Three-dimensional integrated circuit

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POLYN Technology signs first customer for NASP Tiny AI chips - New Electronics

Added to Collection on: 2022-11-30 10:01:40

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Electronic engineering
Academic disciplines
Technology
Computational neuroscience
Digital electronics
Artificial intelligence
Emerging technologies
Computational statistics
Back end of line
Neuromorphic engineering
Neural network
Integrated circuit

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