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Advanced IC packaging is next front in the chip wars - Asia Times

Retrieved on: 2024-08-21 14:02:53

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Summary

The article highlights the competitive dynamics in advanced IC packaging, particularly between the US and China. Cadence's insights and innovations in packaging, like CoWoS, play a crucial role in this landscape, involving key players like TSMC, Huawei, and Intel.

Article found on: asiatimes.com

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