EV Group Achieves Die-to-Wafer Fusion and Hybrid Bonding Milestone with 100-Percent ...

Retrieved on: 2022-07-12 19:00:52

Tags for this article:

Click the tags to see associated articles and topics

EV Group Achieves Die-to-Wafer Fusion and Hybrid Bonding Milestone with 100-Percent .... View article details on hiswai:

Excerpt

Example of a successfully bonded 3D system-on-a-chip (SoC). ... Markus Wimplinger, corporate technology development and IP director at EV Group.

Article found on: www.prnewswire.com