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Retrieved on: 2024-12-18 18:46:31
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Summary
The article discusses Huawei's potential integration of High Bandwidth Memory (HBM) in its Kunpeng SoC to compete with AMD's EPYC and Intel Xeon in the HPC and server markets. This aligns with trends in increasing memory bandwidth, relevant to AMD's focus.
Article found on: www.techradar.com
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