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Retrieved on: 2024-02-23 16:28:17
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Summary
IDTechEx's report highlights the necessity of advanced semiconductor packaging like 2.5D and 3D hybrid bonding to meet high-performance computing demands caused by the growth of GPT-3 and similar AI models. The tags, including various memory technologies and design concepts, relate to the components critical for enhancing system performance for such AI applications.
Article found on: finance.yahoo.com
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