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Octavo doubles up SiP system in package integration ... - eeNews Europe

Retrieved on: 2024-04-18 14:46:27

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Octavo doubles up SiP system in package integration ... - eeNews Europe. View article details on HISWAI: https://www.eenewseurope.com/en/octavo-doubles-up-sip-system-in-package-integration/

Summary

The article describes Octavo's integration of Embedded AI into their SiP packaging, consolidating the STM32MP2 processor with memory like DDR4 SDRAM. Relevant to Intel and FPGA technology, this innovation affects integrated circuits and computer memory sectors.

Article found on: www.eenewseurope.com

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