Article Details
Retrieved on: 2021-08-18 09:45:00
Tags for this article:
Click the tags to see associated articles and topics
Excerpt
The research resulted in the filing of two patents and fabrication of the first ever 3D stacked Arm processor with wireless inter-layer data and power ...
Article found on: www.ecs.soton.ac.uk
This article is found inside other hiswai user's workspaces. To start your own collection, sign up for free.
Sign UpAlready have an account? Log in here