US plan $1.6 billion in funding for packaging computer chips - The Weekly Journal

Retrieved on: 2024-07-10 17:01:35

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US plan $1.6 billion in funding for packaging computer chips - The Weekly Journal. View article details on hiswai:

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A silicon wafer at Applied Materials in Sunnyvale, Calif., on May 22, 2023. Proposed federal funding announced on Tuesday, July 9, 2024, part of ...

Article found on: www.theweeklyjournal.com