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YorChip announces Low Latency 200G Chiplet for edge AI - Design And Reuse

Retrieved on: 2024-06-19 13:50:58

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MIPS To Showcase New Embedded and Edge AI Innovations ... Dream Chip and Cadence Demo Automotive SoC Featuring Tensilica AI IP at embedded world 2024.

Article found on: www.design-reuse.com

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